JPH0129990Y2 - - Google Patents
Info
- Publication number
- JPH0129990Y2 JPH0129990Y2 JP7177584U JP7177584U JPH0129990Y2 JP H0129990 Y2 JPH0129990 Y2 JP H0129990Y2 JP 7177584 U JP7177584 U JP 7177584U JP 7177584 U JP7177584 U JP 7177584U JP H0129990 Y2 JPH0129990 Y2 JP H0129990Y2
- Authority
- JP
- Japan
- Prior art keywords
- cable
- plug
- braid
- plug body
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001681 protective effect Effects 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7177584U JPS60181872U (ja) | 1984-05-15 | 1984-05-15 | シ−ルド付コネクタのプラグ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7177584U JPS60181872U (ja) | 1984-05-15 | 1984-05-15 | シ−ルド付コネクタのプラグ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60181872U JPS60181872U (ja) | 1985-12-03 |
| JPH0129990Y2 true JPH0129990Y2 (en]) | 1989-09-12 |
Family
ID=30609566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7177584U Granted JPS60181872U (ja) | 1984-05-15 | 1984-05-15 | シ−ルド付コネクタのプラグ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60181872U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0729585Y2 (ja) * | 1989-02-27 | 1995-07-05 | 任天堂株式会社 | Ｅｍｉ対策用回路基板の接続構造 |
-
1984
- 1984-05-15 JP JP7177584U patent/JPS60181872U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60181872U (ja) | 1985-12-03 |
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